There are a variety of test processes for testing PCBs. The primary differentiation is made between optical and electronic methods. Which manufacturing and test steps form the optimal test strategy for a production depends on various factors. The complexity, value and quantity of the product to be produced play an important role. All methods or combinations of methods can be applied. Today, a single test method is usually no longer sufficient to find and identify all defects. Combining different test methods can exploit the strengths of individual systems and minimize weaknesses.
Optical test procedures: Automatic Optical Inspection (AOI), Manual Visual Inspection (MVI), X-ray Inspection (AXI)
Electronic test procedures: In-Circuit Tests (ICT), Flying Probe Test, Functional Test, Boundary Scan